Assembly of power electronics
Conventional power electronic modules have a layer structure: Onto a non-conductive carrier substrate, conductive structures are applied onto which power semiconductor chips are mounted. Modules are connected to external systems via bulky plug or screw contacts. This design produces undesired inductance and hardly any further electronic components can be integrated.
Researchers of the KIT Institute of Data Processing and Electronics (IPE) developed a novel concept for the design of low-inductance modules. For this purpose, a plate-shaped connection element is applied vertically to the main substrate for connection of the power electronics with the mainframe circuitry. It accommodates both forward and return conductors and connects the components electrically as well as mechanically. The compact design reduces the space required onto the module substrate.
By means of this new assembly concept, switching times, cooling effort as well as production times are reduced. The module-specific design of the connection element is subject to hardly any limits. For instance, the connector may act as a capacitor if it consists of several interlaced metallic and ceramic layers.
The KIT looks for partners for the further development and industrial use of this technology.
Your contact person for this offer
Dr. Rainer Körber,
Karlsruhe Institute of Technology (KIT)
Innovation Manager, Innovation and Relations Management (IRM)
Phone: +49 721 608-25587